3D Stacked ICs – The Next Dimension to Computing?

Consumer demand for high performance and low power microchips have been a major driving force behind the continued need for scaling of semiconductor devices. Today’s semiconductor chips face extreme pressure to achieve increased performance, while reducing their size and accommodating new functionalities. When the size of the transistors shrink, interconnect delay and power consumption affects performance adversely. In SoCs (System on a Chip), longer interconnects translate into reduced speed Read more [...]
Rahul Vijh
Rahul Vijh

There is nothing permanent except change. And it’s that change that Rahul enjoys blogging about. Whether it is the latest change to patent law, or the biggest, newest, latest device on the market, Rahul is sure to be up to date with the story, the background and the future.


Post a Comment

Your email address will not be published. Required fields are marked *